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HD74LV00A
Quad. 2-input NAND Gates
ADE-205-240 (Z) 1st Edition March 1999 Description
The HD74LV00A has four two-input NAND gates in a 14-pin package. Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook computers), and the low-power consumption extends the battery life.
Features
* * * * * * VCC = 2.0 V to 5.5 V operation All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25C) Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25C) Output current 6 mA (@VCC = 3.0 V to 3.6 V), 12 mA (@VCC = 4.5 V to 5.5 V)
Function Table
Inputs A H L X Note: H: High level L: Low level X: Immaterial B H X L Output Y L H H
HD74LV00A
Pin Arrangement
1A 1B 1Y
1 2 3
14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A
2A 4 2B 2Y 5 6
GND 7
8 3Y
(Top view)
2
HD74LV00A
Absolute Maximum Ratings
Item Supply voltage range Input voltage range*
1 1, 2
Symbol VCC VI VO
Ratings -0.5 to 7.0 -0.5 to 7.0 -0.5 to VCC + 0.5 -0.5 to 7.0
Unit V V V
Conditions
Output voltage range*
Output: H or L VCC: OFF
Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation at Ta = 25C (in still air)*3
I IK I OK IO I CC or IGND PT
-20 50 25 50 785 500
mA mA mA mA mW
VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
SOP TSSOP
Storage temperature
Tstg
-65 to 150
C
Notes: The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
3
HD74LV00A
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Output current Symbol VCC VI VO I OH Min 2.0 0 0 -- -- -- -- I OL -- -- -- -- Input transition rise or fall rate t /v 0 0 0 Operating free-air temperature Ta -40 Max 5.5 5.5 VCC -50 -2 -6 -12 50 2 6 12 200 100 20 85 C ns/V A mA Unit V V V A mA VCC = 2.0 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 2.0 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V Conditions
Note: Unused or floating inputs must be held high or low.
4
HD74LV00A
Logic Diagram
A B Y
5
HD74LV00A
DC Electrical Characteristics
* Ta = -40 to 85C
Item Input voltage Symbol VIH VCC (V)* 2.0 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 VIL 2.0 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 Output voltage VOH Min to Max 2.3 3.0 4.5 VOL Min to Max 2.3 3.0 4.5 Input current Quiescent supply current Output leakage current Input capacitance IIN ICC IOFF CIN 0 to 5.5 5.5 0 3.3 Min 1.5 VCC x 0.7 VCC x 0.7 VCC x 0.7 -- -- -- -- VCC - 0.1 2.0 2.48 3.8 -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 3.3 Max -- -- -- -- 0.5 VCC x 0.3 VCC x 0.3 VCC x 0.3 -- -- -- -- 0.1 0.4 0.44 0.55 1 20 5 -- A A A pF V IOH = -50 A IOH = -2 mA IOH = -6 mA IOH = -12 mA IOL = 50 A IOL = 2 mA IOL = 6 mA IOL = 12 mA VIN = 5.5 V or GND VIN = VCC or GND, IO = 0 VO = 5.5 V VI = VCC or GND Unit V Test Conditions
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
6
HD74LV00A
Switching Characteristics
* VCC = 2.5 0.2 V
Ta = 25C Ta = -40 to 85C Max 12.9 16.6 Min 1.0 1.0 Max 15.0 20.0 Unit ns Test Conditions CL = 15 pF CL = 50 pF FROM (Input) TO (Output) Y
Item Propagation delay time
Symbol tPLH tPHL
Min -- --
Typ 7.1 9.6
A or B
* VCC = 3.3 0.3 V
Ta = 25C Ta = -40 to 85C Max 7.9 11.4 Min 1.0 1.0 Max 9.5 13.0 Unit ns Test Conditions CL = 15 pF CL = 50 pF FROM (Input) TO (Output) Y
Item Propagation delay time
Symbol tPLH tPHL
Min -- --
Typ 5.0 6.9
A or B
* VCC = 5.0 0.5 V
Ta = 25C Ta = -40 to 85C Max 5.5 7.5 Min 1.0 1.0 Max 6.5 8.5 Unit ns Test Conditions CL = 15 pF CL = 50 pF FROM (Input) TO (Output) Y
Item Propagation delay time
Symbol tPLH tPHL
Min -- --
Typ 3.6 4.9
A or B
7
HD74LV00A
Operating Characteristics
* CL = 50 pF
Ta = 25C Item Power dissipation capacitance Symbol CPD VCC (V) 3.3 Min -- Typ 9.5 Max -- Unit pF Test Conditions f = 10 MHz
5.0
--
11.0
--
Noise Characteristics
* CL = 50 pF
Ta = 25C Item Quiet output, maximum dynamic VOL Quiet output, minimum dynamic VOL Quiet output, minimum dynamic VOH High-level dynamic input voltage Low-level dynamic inout voltage Symbol VOL (P) VCC (V) 3.3 Min -- Typ 0.2 Max 0.8 Unit V Test Conditions
VOL (V)
3.3
--
-0.1
-0.8
VOH (V)
3.3
--
3.1
--
VIH (D)
3.3
2.31
--
--
V
VIL (D)
3.3
--
--
0.99
8
HD74LV00A
Test Circuit
Measurement point
CL*
Note: CL includes the probe and fig capacitance.
* Waveform - 1
tr 90% 50% VCC 10% t PLH 90% 50% VCC
tf VCC 10% t PHL 0V
Input
VOH In phase output t PHL 50% VCC 50% VCC VOL t PLH VOH Out of phase output 50% VCC 50% VCC VOL
Notes: 1. Input waveform: PRR 1 MHz, Zo = 50 , tr 3 ns, t f 3 ns 2. The output are measured one at a time with one transition per measurement.
9
HD74LV00A
Package Dimensions
Unit: mm
10.06 10.5 Max 14 8 5.5 1 7 0.22 0.05 0.20 0.04 2.20 Max 7.80 - 0.30 1.15 0 - 8 0.70 0.20
+ 0.20
1.42 Max
1.27 0.42 0.08 0.40 0.06
0.12 M
Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DA -- Conforms 0.23 g
Dimension including the plating thickness Base material dimension
10
0.10 0.10 0.15
HD74LV00A
Unit: mm
8.65 9.05 Max 14 8 3.95 1 1.75 Max 7
*0.22 0.03 0.20 0.03
0.10 6.10 + 0.30 -
0.635 Max
1.08 0 - 8
0.11 0.14 + 0.04 -
1.27 *0.42 0.08 0.40 0.06
0.67 0.60 + 0.20 -
0.15 0.25 M
Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DN Conforms Conforms 0.13 g
*Dimension including the plating thickness Base material dimension
11
HD74LV00A
Unit: mm
5.00 5.30 Max 14 8 4.40 1
+0.08 -0.07
7 0.65 1.0 0.13 M 0.83 Max 0.17 0.05 0.15 0.04 6.40 0.20 0 - 8 0.50 0.10
0.22 0.20 0.06
1.10 Max
0.10
0.07 +0.03 -0.04
Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
TTP-14D -- -- 0.05 g
12
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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